1. Clean room class 1000

1.1 MASK ALIGNER MJB4

The MJB4 Mask Aligner is a precision instrument for high-resolution photolithography and is intended for use in research laboratories, small-series production and pilot projects.

The flexibility of the MJB4 is unsurpassed when exposing standard wafers and substrates and irregularly shaped substrates with a diameter of up to 100 mm or 4"x 4" and various thicknesses.

1.2 PLASMA ENHANCED CHEMICAL VAPOR DEPOSTION (PLASMPLUS80)

The Plasmalab80Plus is a plasma processing system, which can be configured to carry out Plasma Enhanced Chemical Vapor Deposition (PECVD).

It is used to deposit thin films of silicon dioxide, silicon nitride, amorphous silicon, silicon carbide, diamond-like carbon and other materials

1.3 OPTICAL MICROSCOPE

The fully motorized Olympus BX61 is a computer-controlled conventional wide-angle (non-confocal) upright microscope. Equipped with a motorized stage and a high-resolution digital camera, this platform allows for maximum flexibility in excitation and emission wavelengths with dual filter wheels. All major microscope functions can be completely automated, including focus, illumination, objective lens selection and filter wheels. High-quality Phase and Differential Interference Contrast are fully supported. Live cell imaging is available either via water-immersion objectives or a Bioptechs FCS-3 incubation chamber (requires growing cells on special coverslips).

1.4 SCANNING PROB MICROSCOPE

Molecular Imaging’s PicoPlus is a new, modular Scanning Probe Microscope (SPM) system that has been designed with you, the user, in mind. This versa-tile, upgradeable system combines the new PicoSPM® II Microscope, multi-pur-pose Scanners, and PicoScan™ Controller with additional modular components. The result is a multifaceted platform that offers numerous unique features and superior performance.

1.5 SPIN COATER

WS400-E-6npp-LITE SHOWN with option al exausted drain reservior used to produced thin films on flat substrates. We can have rotation 8999 rpm.

1.6 E-BEAM EVAPORATOR

Auto 500 system is capable of deposition from an electron beam gun source. This system offers the most versatile method for producing high quality thin films of both metal and non-metals. The advantages of this system include fast pump down to process time, easy access to sources, user friendly system control and high level of safety interlocking.

2. SPUTTRING UNIT

DP 650 is thin film deposition, as well as sputtering or evaporation becomes more and more used in various applications like:

• Microelectronics
• Sensors
• Technical film

3. ELLIPSOMETRY

The SENTECH Spectroscopic Ellipsometer family is used for thin film and material characterization in R & D. It provides thin film thickness, refractive index, absorption and related properties like material composition, index gradient, surface and interface roughness as well as anisotropic behavior for multi-layer stacks.
SE 850:280 - 1700 (2500) nm

4. Furnaces (tube and box)

Tube furnance with maximum temperature 1600 Celcius, use for anealing, sitering and nano structure carbon nano tube.

5. SYNOPSYS TCAD

Technology CAD(TCAD) refers to using computer simulations to develop and optimize semiconductor processing technologies and devices. TCAD simulation tools solve fundamental physical partial differential equations, such as diffusion and transport equations for discredized geometries , representing the silicon wafer or the layer system in a semiconductor device. This deep physical approach gives TCAD simulation predictive accuracy.

6. UHV chamber for buffer layer assisted growth

Ultra high vaccum chamber (UHV) up to 10 e-10 torr for nano particles synthesis by Buffer layered assisted growth(BLAG), capable of physical vapour deposition by ressitive heating (thermal evaporation) cooling by closed Cycle helium cryostat for temperatures (20k). UHV enables us oto gorow high Quality thin films of orders of monolayers

7. ELECTRICAL CHARACTERIZATION